Quik-Pak, a division of Delphon Industries, offers IC packages, assembly and prototype services. We specialize in open-cavity plastic packages and assembly in 24 hours or less. A limitless array of open-cavity packages are available with no minimum quantity and can be provided as part of a turn-key assembly solution along with wafer backgrinding & dicing, die pick & place, die/wire bonding, remolding and marking/branding. Custom assembly services are also offered for ceramic packages, chip-on-board, stacked die, MEMS, BGA balling & repair, etc. Quik-Pak’s unique offerings deliver faster time to market and reduced prototype costs for new devices, while providing excellent flexibility, quality and customer service.
Keywords: IC assembly, IC packages, dicing, backgrinding, wire bonding, marking.
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